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Call for papers: "Micro/Nano Electronics and MEMS/NEMS Packaging"
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PostPosted: Sun Jun 04, 2006 8:57 am    Post subject: Call for papers: "Micro/Nano Electronics and MEMS/NEMS Packaging" Reply with quote


International Journal of Materials and Product Technology (IJMPT)

Call For papers

Special Issue on: "Micro/Nano Electronics and MEMS/NEMS Packaging"

Guest Editors:
Professor Cemal Basaran, University at Buffalo, State University of New
York, USA
Dr. Hua Ye, State University of New York at Albany, USA
Professor Juan Gomez, EAFIT University, Colombia

The electronics industry has experienced a continuously increasing
trend towards miniaturisation during the recent years. New and
innovative products are placed into the market every day at sizes
ranging from a few millimetres to a few microns. This marked tendency
has brought new challenges and questions to the engineering and
scientific community responsible for the design and development of the
product that is finally placed into the market.

Topics and questions previously raised and fully answered in other
related fields appear like new paradigms once the involved sizes go
below certain characteristic dimensions. Fully validated physical
models, experimental techniques, computational methods and design
procedures, among others, need to be revisited.

This special issue on micro/nano electronics is intended to be the
proper scenario for posting new questions, discussing different points
of view and identifying future challenges in all the aspects related to
the development of micro/nanoelectronics and MEMS/NEMS packages. We
invite the scientific and engineering community to present and discuss
their points of views at the highest level through this special issue
of IJMPT. We therefore formally extend this call for high quality
research papers not previously published elsewhere and regarding all
the aspects related to the current state of the art and future trends
in micro/nanoelectronics and development of MEMS/NEMS systems.

Subject Coverage

Topics for discussion include but are not limited to:

* Electronic and photonic packaging
* Mechanical, quality and reliability issues in
* MEMS/NEMS packaging (including process and reliability)
* Micro/nanoelectronics/optoelectronic packaging
* Nanoscale phenomenon in micro/nanoelectronics
* Thermal management for micro/nanoelectronics
* Integration and packaging of micro/nano/electronic systems
* Material development and constitutive modelling for MEMS/NEMS
* Non-standard packaging
* Innovative experimental techniques for material characterisation
at the micron and submicron level
* Numerical methods for micron and submicron level applications

Notes for Intending Authors

Submitted papers should not have been previously published nor be
currently under consideration for publication elsewhere

All papers are refereed through a peer review process. A guide for
authors, sample copies and other relevant information for submitting
papers are available on the Papers Submission section under Author

Important Dates

Papers must be submitted by: 1 October, 2006
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